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 Obsolescence Notice
This product is obsolete. This information is available for your convenience only. For more information on Zarlink's obsolete products and replacement product lists, please visit
http://products.zarlink.com/obsolete_products/
ZIF100
ZIF100
Direct Conversion 4FSK Data Receiver Target Specification
DS4760 - 1.2 August 1997
The ZIF100 IC is a direct conversion receiver. The device provides the functions required for the reproduction of I and Q from either 2FSK or 4FSK transmission. Adjacent channel rejection is provided using programmable channel filters. RF and Audio AGC functions assist operation when large interfering signals are present. The ZIF100 also includes an on chip 1 volt regulator function capable of sourcing up to3mA and a battery flag function. Both the I and Q channel outputs and battery flag have open collector outputs to ease their interface with other devices.
PIN 1
PIN 32
PIN 1 IDENT
FEATURES s Low Power Consumption - most of the device is powered directly from a single cell to minimise the power consumed s Very Competitive Sensitivity Performance s Programmable Channel Filtering s 1 Volt Regulator and 1.25 Volt Reference Voltage with Pre-wakeup Mode s Wide Range Automatic Gain Control (AGC) including Mixer Overload Protection s Bettery Economy Function s 1mm Thick TQFP Package s Programmable LNA Current Source APPLICATIONS s Pagers - including small form factor designs such as credit card pagers, watch pagers and PCMCIA applications s Low data rate receivers - security/remote control
REG REGC. IA IB 1.1V BAT-F TP1 CAPI
TP32
1 2 3 4 5 6 7 8 IPIN ILNA GND RFINA DCMX RFINB REGC REG 9 10 11 12 13 14 15 16 IA IB VCC1 LOI FSET LOQ QA QB 17 18 19 20 21 22 23 24 VCC2 VREF TP1 BEC FAST-CH REG-ON TP2 CAPI 25 26 27 28 29 30 31 32 CAPQ BAT-F QOUT IOUT AGC-LNA IREF ISET AGC
ABSOLUTE MAXIMUM RATINGS Supply Voltage Storage temerature Operating temerature
TP2 BEC REG-ON FAST-CH
4V -55C to +150C -20C to +70C
CONTROL VREF 1.0V LOI RFINA VCC1 VREF
DCMX VREF
IOUT
FSET QOUT RFINB
VREF FSET VCC2 VCC1 GND AGC
ILNA IPIN
LOQ QA QB
VCC2 VCC1 GND CAPQ
FSET
IREF ISET AGC AGC-LNA
Fig.2 ZIF100 block diagram
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ZIF100
PACKAGE DETAILS
Dimensions are shown thus: mm (in). For further package information, please contact your local Customer Service Centre.
PIN 1
0 - 7 0*20 (0*009) MAX. PIN 32 0*95/1*05 (0*037/0*041)
6*90/7*10 (0*272/0*280) SQ.
PIN 1 IDENT 5*60 (0*22) NOM. 8*80/9*20 (0*346/0*362)
1*20 (0*047) MAX.
0*45/0*75 (0*018/0*030)
0*30/0*45 (0*012/0*018)
32 LEADS AT 0*80 (0*0315) NOM. SPACING
0*05/0*15 (0*002/0*006)
NOTES 1. Controlling dimensions are millimetres. 2. This package outline diagram is for guidance only. Please contact your Mitel Semiconductor Customer Service Centre for further information.
32-LEAD THIN PLASTIC QUAD FLATPACK - TP32
HEADQUARTERS OPERATIONS MITEL SEMICONDUCTOR Cheney Manor, Swindon, Wiltshire SN2 2QW, United Kingdom. Tel: (01793) 518000 Fax: (01793) 518411 MITEL SEMICONDUCTOR 1500 Green Hills Road, Scotts Valley, California 95066-4922 United States of America. Tel (408) 438 2900 Fax: (408) 438 5576/6231
Internet: http://www.gpsemi.com CUSTOMER SERVICE CENTRES q FRANCE & BENELUX Les Ulis Cedex Tel: (1) 69 18 90 00 Fax : (1) 64 46 06 07 q GERMANY Munich Tel: (089) 419508-20 Fax : (089) 419508-55 q ITALY Milan Tel: (02) 6607151 Fax: (02) 66040993 q JAPAN Tokyo Tel: (03) 5276-5501 Fax: (03) 5276-5510 q KOREA Seoul Tel: (2) 5668141 Fax: (2) 5697933 q NORTH AMERICA Scotts Valley, USA Tel: (408) 438 2900 Fax: (408) 438 5576/6231 q SOUTH EAST ASIA Singapore Tel:(65) 3827708 Fax: (65) 3828872 q SWEDEN Stockholm Tel: 46 8 702 97 70 Fax: 46 8 640 47 36 q TAIWAN, ROC Taipei Tel: 886 2 25461260 Fax: 886 2 27190260 q UK, EIRE, DENMARK, FINLAND & NORWAY Swindon Tel: (01793) 726666 Fax : (01793) 518582 These are supported by Agents and Distributors in major countries world-wide. (c) Mitel Corporation 1998 Publication No. DS4760 Issue No. 1.2 August 1997 TECHNICAL DOCUMENTATION - NOT FOR RESALE. PRINTED IN UNITED KINGDOM
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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For more information about all Zarlink products visit our Web Site at
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Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively "Zarlink") is believed to be reliable. However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the use of product in certain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink. This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other information appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink's conditions of sale which are available on request.
Purchase of Zarlink's I2C components conveys a licence under the Philips I2C Patent rights to use these components in and I2C System, provided that the system conforms to the I2C Standard Specification as defined by Philips. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright Zarlink Semiconductor Inc. All Rights Reserved.
TECHNICAL DOCUMENTATION - NOT FOR RESALE


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